CIJIN Technology Co., Ltd. is a high-tech enterprise specializing in the R&D, manufacturing, and sales of chip-level electronic components. Leveraging advanced materials, we provide comprehensive packaging solutions for the global semiconductor industry. Our core expertise encompasses electronic materials, electronic pastes, ceramic packages, ceramic substrates, and ceramic metallization. We boast fully integrated manufacturing capabilities across eight major technical domains, including paste formulation, precision mold design, automation development, electrochemical surface treatment, and high-temperature sintering.
Founded in April 2015, our company operates a state-of-the-art 58,000-square-meter facility with a dedicated workforce of over 1,000 employees. Driven by a strong commitment to innovation, 30% of our staff are senior technical R&D personnel, and 10% hold master's degrees or higher. Supported by fully equipped testing and laboratory facilities, we have secured over 78 authorized patents (including 20+ invention patents and 58+ utility models). We are proudly recognized as a National High-Tech Enterprise and a "Specialized, Fined, Peculiar and Innovative" (SRDI) enterprise. Furthermore, our collaborative smart manufacturing project has been awarded the title of "Digital Workshop for Microelectronic Co-fired Ceramic Devices" by the Ministry of Industry and Information Technology (MIIT).
Operating through our two subsidiaries—CIJIN Technology (Henan) Co., Ltd. and CIJIN Technology (Dengfeng) Co., Ltd.—we manufacture a wide range of specifications for PKG (Ceramic Packages), Lids, and PFP (Plastic Flat Package) crystal oscillators. We have successfully delivered leading solutions for diverse sectors, including frequency components, optical communication devices, filters, laser devices, CPUs, and sensors.
Today, our products and solutions are widely applied in smart homes, medical equipment, autonomous driving, wireless communications, GPS positioning, LCD drivers, consumer electronics, wireless security systems, and industrial control. Backed by comprehensive quality and environmental management systems, we adhere to the path of independent innovation. Our mission is to build a world-class production base for high-end electronic components, empowering global smart devices and delivering advanced electronic packaging solutions worldwide.
